Dab tsi yog ULPA filter tiag tiag
ULPA lim yog Ultra-Low Penetration Air filter cais raws li EN 1822 Group U. Cov chav kawm txwv yog:
•U15: integral efficiency Ntau dua los yog sib npaug rau 99.9995%
•U16: integral efficiency Ntau dua los yog sib npaug rau 99.99995%
•U17: integral efficiency Ntau dua los yog sib npaug rau 99.999995%
Ntawd yog sab kev faib tawm. Hauv kev ua lag luam, koj tseem yuav pom ULPA cov khoom piav qhia txog 99.9995% ntawm 0.1-0.2 μm lossis nyob ib ncig ntawm 0.12 μm, tshwj xeeb tshaj yog nyob rau hauv cov khoom siv vaj huam sib luag rau cov khoom siv hluav taws xob. Piv txwv li, ib qho qis -boron ULPA cov khoom siv rau kev siv semiconductor yog luam tawm ntawm 99.9995% @ 0.1-0.2 μm, thiab ntau cov lus qhia sib piv siv 0.12 μm raws li qhov siv tau loj rau ULPA kev sib tham.
U15 lim efficiency, piav qhia tsis muaj kev lag luam pos huab
Thaum cov neeg yuav khoom nug txog U15 lim efficiency, lawv feem ntau xav tau luv luv version:
•U15 yog chav kawm ULPA nkag
• Raws li EN 1822, nws tau ntsuas ntawm 99.9995% kev ua haujlwm zoo
• nyob rau hauv cov ntaub ntawv cov khoom, nws yog feem ntau piav nyob ib ncig ntawm 0.1-0.2 μm kev ua tau zoo
• nws zaum saum H14 hauv kev pom kev ua haujlwm thiab feem ntau yog siab dua H14 hauv kev pib ua haujlwm thiab tus nqi ib yam
Peb cov engineers feem ntau pom cov neeg yuav khoom sib xyaw peb lub tshuab sib txawv:
• ISO 16890 / legacy EN 779 rau cov lim cua dav dav
•EN 1822 / ISO 29463 rau EPA, HEPA, thiab ULPA
• Cov ntsiab lus teb xws li "kev kho mob HEPA" lossis "lub tsev tu ULPA"
Txhob sib piv aG4, MERV 8, lossis ePM1 limrau aU15 vaj huam sib luagzoo li yog lawv koom nrog tib tsob ntoo txiav txim siab. Lawv tsis ua. ULPA belongs rau qhov tseeb - lim sab ntawm lub khw
ULPA vs HEPA lim: qhov sib txawv tiag tiag
Qhov yooj yim efficiency kis tau yooj yim hais. Qhov nyuaj tshaj yog piav qhia qhov qhov sib txawv ntawd ua rau lub cev.
Raws li EN 1822:
H13:Ntau dua lossis sib npaug li 99.95%
H14:Ntau dua lossis sib npaug li 99.995%
U15:Ntau dua lossis sib npaug rau 99.9995%
U16:Ntau dua lossis sib npaug rau 99.99995%
U17:Ntau dua lossis sib npaug rau 99.999995%
Qhov ntawd txhais tau tias aULPA vs HEPA limkev txiav txim siab tsis yog hais txog "cua huv huv." Nws feem ntau cuam tshuam rau:
Thaum Ntxov Siab
kiv cua xaiv
FFU lossis lub davhlau ya nyob twg module siv zog
hloov lub caij nyoog economics
leak-kev xeem thiab kev cia siab rau kev tsim nyog
seb tus txheej txheem puas tau txais txiaj ntsig los ntawm qhov kawg ntawm qhov ua tau zoo
Qhov kev lag luam tawm no- feem ntau tau pom meej meej hauv cov khoom siv hluav taws xob semiconductor cleanroom kab. Lawv cov microelectronic vaj huam sib luag muaj nyob rau hauv H14 thiab U15-U17 qhov ntau thiab tsawg, hais txog qhov tsis tshua muaj siab poob, ultra- tso pa roj tsawg, thiab tsim nyog rau microelectronic cleanrooms thiab khoom siv. Qhov no qhia tau hais tias thaum koj nkag mus rau hauv thaj chaw ntawm semiconductor huab cua pom, kev sib tham tsis yog hais txog kev tshem tawm cov teeb meem, tab sis kev xav txog kev tswj cov khoom, molecular-theem huv, thiab kev siv lub zog.
Ib qho yooj yim-Lus Askiv txoj kev saib nws
HEPA feem ntau yog cov lus teb zoo thaum chav tsev tsim nyob ib puag ncig kev tiv thaiv kab mob, kev tiv thaiv cov khoom lag luam, lossis kev ua kom huv siab yam tsis muaj qhov cuam tshuam loj heev.
ULPA yog cov lus teb yog thaum cov txheej txheem yog rhiab heev rau cov khoom me me, kev ua siab ntev me me, thiab lub hom phiaj ntawm chav huv ntau dua.
Yog vim li cas ib daim pam zoo li "ULPA zoo dua" tsis muaj txiaj ntsig. Hauv ntau qhov haujlwm, ULPA yog qhov zoo dua yog tias cov txheej txheem tuaj yeem ua pov thawj qhov kev poob siab ntxiv thiab tus nqi.
Vim li cas cov chav ua haujlwm feem ntau nres ntawm HEPA, thaum chip fabs feem ntau txav mus rau ULPA
Qhov no yog qhov uas daim ntawv thov logic tseem ceeb tshaj li phau ntawv qhia lus.
Cov chav ua haujlwm thiab chaw kho mob
ASHRAE 170 teeb tsa lub hauv paus pom rau cov chav ua haujlwm tsawg kawg yog MERV 16, thiab nws tshwj xeeb hu rau HEPA lim ntawm lub tshuab hluav taws xob hauv huab cua hauv qee qhov tshwj xeeb LOSSIS cov xwm txheej xws li cov txheej txheem orthopedic, hloov pauv, neurosurgery, thiab cov txheej txheem kub hnyiab. Hauv lwm lo lus, kev taw qhia kev noj qab haus huv tsis kho ULPA raws li cov lus teb ua ntej rau tus qauv LOSSIS tsim. Txawm tias qhov twg HEPA siv, lub hom phiaj yog kis kab mob- tswj kev pheej hmoo thiab kev tiv thaiv huab cua hla ntawm thaj chaw phais, tsis yog semiconductor- qib kev tiv thaiv.
Yog li thaum cov neeg yuav khoom hais tias "chav phais siv HEPA," uas feem ntau yog qhov kev coj ua. Lub hom phiaj kev saib xyuas kev noj qab haus huv yog siab, tab sis nws yog tsav los ntawm tus neeg mob kev nyab xeeb thiab cov txheej txheem airflow tsim, tsis yog los ntawm particle thiab molecular rhiab heev ntawm cov txheej txheem wafer.
Semiconductor fabs thiab advanced electronics
Cov chaw semiconductor yog lub ntiaj teb sib txawv. Camfil's semiconductor guidance hais tias fabs siv ua kom pom tseeb thiab AMC- tswj cov kev daws teeb meem kom txo qis me me thiab molecular concentrations mus rau ISO Class 1 qib rau cov khoom thiab sub- ppb qib rau cov pa hauv huab cua. Lawv cov khoom siv hluav taws xob- tsom rau cov chav huv huv yog muaj nyob rau hauv HEPA H14 thiab ULPA U15, U16, U17, tshwj xeeb tshaj yog rau kev lag luam microelectronic thiab nrog ultra{10}} cov khoom qis qis.
Tias yog vim li cas cov chips siab heev feem ntau txav dhau HEPA thiab mus rau ULPA, tshwj xeeb tshaj yog nyob rau hauv cov txheej txheem tseem ceeb, cov cuab yeej mini-ib puag ncig, thaj chaw lithography, lossis lwm qhov chaw ntawm fab uas cov khoom me me thiab cov kab mob molecular kis ncaj qha tawm los. Ib txoj hauv kev los hais nws yog qhov no:
lub tsev kho mob tiv thaiv cov neeg mob thiab cov txheej txheem
lub chip fab yog tiv thaiv tawm los ntawm ib tug deb tighter defect pib
Ib lo lus: huv si. Qhov sib txawv heev.
Vim li cas qis -boron lim xov xwm tseem ceeb hauv electronics
Nov yog ib qho ntawm cov ntsiab lus uas ntau tus tsis yog - cov neeg yuav khoom hluav taws xob tsis nco.
Hauv semiconductor cleanrooms, lub lim tsis tuaj yeem kho raws li lub thawv inert. Lub lim nws tus kheej tuaj yeem dhau los ua qhov chaw paug yog tias cov xov xwm lossis cov khoom tawm tawm tsis xav tau dopants lossis cov kab mob molecular.
Ib xyoo 1991 txoj kev tshawb fawb ntawm silicon microelectronics pom tias cov pa paug hauv huab cua tau taug qab mus rau borosilicate iav hauv siab -kev ua tau zoo ntawm cov lim cua. Tom qab kev lag luam kev tshaj tawm tau sau tseg tias cov iav tsoos - cov chaw muag khoom fiber ntau tau tsim qis - cov khoom lag luam boron, thiab cov xov xwm no tau txais kev lees paub hauv khw los teb rau cov kev cai semiconductor.
Cov keeb kwm yav dhau los piav qhia tias vim li cas cov khoom siv hluav taws xob niaj hnub no -qib ULPA cov khoom lag luam hais txog qis -boron, dopant-dawb, lossis ultra- kev tsim kho qis qis. Ib qho tam sim no qis-boron ULPA cov khoom lag luam rau sub-14 nm semiconductor daim ntawv thov hais tias qis-boron iav-fiber media tiv thaiv cov lim-cov kab mob boron paug, thiab tshwj xeeb ceeb toom tias boron nyob rau hauv standard ULPA media tuaj yeem outgas nyob rau hauv siab {{11} thiab p11} ua rau tsis muaj purity. Camfil ua qhov zoo sib xws los ntawm lwm lub kaum sab xis los ntawm kev txhawb nqa ultra-tsawg tawm, tsis muaj dopant nyob rau hauv nws cov microelectronics cleanroom panels.
Qhov ntawd txhais li cas rau cov neeg yuav khoom
Yog tias koj qhov project nyob hauv:
• wafer fabrication
• lithography
•photoresist txheej / raug
• ntim khoom ua ntej
• cov cuab yeej microelectronics lossis mini-ib puag ncig
ces kev sib tham yuav tsum dhau musULPA efficiencythiab suav nrog:
•low-boron media
• dopant-kev tsim kho dawb
•low-organic outgassing
•kev sib raug zoo nrog AMC- tswj lub tswv yim
Rau semiconductor cua pom, uas tsis yog khoom kim heev. Nws yog ib feem ntawm kev tiv thaiv txheej txheem.
Yuav ua li cas peb coj cov neeg siv khoom los ntawm ULPA vs HEPA kev txiav txim siab
Peb cov engineers feem ntau pib nrog daim ntawv thov, tsis yog cov chav lim dej.
Peb nug plaub nqe lus nug ua ntej:
• Lub hom phiaj kev huv ntawm chav tsev lossis cheeb tsam txheej txheem yog dab tsi?
•Puas yog txheej txheem rhiab heev rau bioburden, hais, los yog molecular paug?
•Lub kaw lus puas tuaj yeem nqus tau qhov poob siab dua uas feem ntau tuaj nrog cov lim lim?
• Puas yog qhov project hauv kev kho mob / chaw muag tshuaj, lossis hauv microelectronics / semiconductor?
Tsis ntev los no peb tau pab ib tus neeg siv khoom nyob rau sab hnub tuaj Asia uas pib thov U15 thoob plaws tag nrho cov haujlwm vim tias lawv pab pawg tau xav tias "qib siab dua txhais tau tias muaj kev nyab xeeb dua." Nws muab tawm tsuas yog cov txheej txheem microelectronic tseem ceeb hauv cheeb tsam xav tau ULPA. Cov cheeb tsam txhawb nqa tuaj yeem nyob ntawm HEPA- qib ntsuas lub davhlau ya nyob twg. Qhov kev hloov ntawd tau txiav ob lub nra ntawm cov kiv cua thiab cov peev nyiaj lim dej uas tsis ua rau cov txheej txheem tiag tiag tsis muaj zog- tswj kev pheej hmoo.
Qhov ntawd yog feem ntau yog txoj hauv kev. Siv ULPA qhov twg nws daws qhov teeb meem tiag tiag. Tsis txhob kis mus rau txhua qhov chaw tshwj tsis yog cov txheej txheem xav tau tiag tiag.
Ib daim ntawv teev kev yuav khoom
ua ntej koj ua tiav cov lus qhia, xyuas cov ntsiab lus no:
Txheem: EN 1822 / ISO 29463, tsis yog dav dav - cov qauv cua tshuab
Chav Kawm: H13, H14, U15, U16, lossis U17 raws li txheej txheem xav tau
Efficiency hauv paus: MPPS thiab luam tawm ib qho kev ua tau zoo
Pib Siab Poob: sib phim rau tus kiv cua, FFU, lossis lub davhlau ya nyob twg module
Daim ntawv thov: phais / kho mob, pharma, semiconductor, los yog cuab yeej ib puag ncig
Media txaus ntshai: txheem iav media, qis-boron iav media, lossis dopant-dawb membrane media
Kev tsim kho: qis- cov khoom siv hluav taws xob tawm yog siv rau hauv cov khoom siv hluav taws xob
Kev ntsuam xyuas cov dej ntws: ib tus zuj zus scan - kuaj qhov twg yuav tsum tau los ntawm daim ntawv thov

